EP3CLS200F484I7 vs EP3CLS200F484C7N Vergleich
Detaillierter Direktvergleich von EP3CLS200F484I7 von Intel und EP3CLS200F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484I7 | EP3CLS200F484C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.580,00 | $1.650,00 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 198464 | 198,464 |
| CLBs | 198464 | — |
| Total Memory Bits | 8211456 bits (~1.0 MB) | — |
| Embedded Memory Blocks | 432 M9K blocks | — |
| User I/O Pins | 210 | — |
| Maximum Operating Frequency | 450 MHz | — |
| Number of PLLs | 4 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Versorgungsspannung | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 65 nm low-power CMOS |
| Betriebstemperatur | -40 °C to +85 °C (Industrial) | 0C to +85C (commercial) |
| Gehäuse | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Bitstream Encryption | AES (Cyclone III LS feature) | — |
| Series | — | Cyclone III LS |
| Logic Array Blocks (LAB) | — | 12,404 |
| Embedded Memory | — | 8,211,456 bits |
| Embedded 18x18 Multipliers | — | 210 |
| User I/O | — | 226 |
| Configuration Modes | — | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |
| PLLs | — | 4 |
| RoHS-Status | — | Compliant |