EP3CLS200F484I7 vs EP3CLS200F484C7N Comparación
Comparación detallada lado a lado de EP3CLS200F484I7 por Intel y EP3CLS200F484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F484I7 | EP3CLS200F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.580,00 | $1.650,00 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 198464 | 198,464 |
| CLBs | 198464 | — |
| Total Memory Bits | 8211456 bits (~1.0 MB) | — |
| Embedded Memory Blocks | 432 M9K blocks | — |
| User I/O Pins | 210 | — |
| Maximum Operating Frequency | 450 MHz | — |
| Number of PLLs | 4 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Tensión de alimentación | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 65 nm low-power CMOS |
| Temperatura de funcionamiento | -40 °C to +85 °C (Industrial) | 0C to +85C (commercial) |
| Encapsulado | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Bitstream Encryption | AES (Cyclone III LS feature) | — |
| Series | — | Cyclone III LS |
| Logic Array Blocks (LAB) | — | 12,404 |
| Embedded Memory | — | 8,211,456 bits |
| Embedded 18x18 Multipliers | — | 210 |
| User I/O | — | 226 |
| Configuration Modes | — | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |
| PLLs | — | 4 |
| Estado RoHS | — | Compliant |