EP3CLS200F780I7N vs EP3CLS200F780I7 Vergleich
Detaillierter Direktvergleich von EP3CLS200F780I7N von Intel und EP3CLS200F780I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F780I7N | EP3CLS200F780I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $240,00 | $142,50 |
| Device Family | Cyclone III LS | Cyclone III LS |
| Series | EP3CLS200 | Cyclone III LS |
| Logic Elements | 198,464 | 198,464 |
| Logic Array Blocks (LABs) | 12,404 LAB | 12,040 LAB |
| Embedded Memory (bits) | 8,211,456 | — |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 413 | — |
| Process Technology | 65 nm CMOS (low-power) | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | — |
| Betriebstemperatur | -40 °C to +100 °C (industrial) | -40 C to +85 C (Industrial) |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| Gehäuse | 780-ball FBGA (FBGA-780) | 780-BGA (FBGA) |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | Surface Mount (SMD/SMT) |
| RoHS-Status | Compliant (lead-free per FBGA-780 datasheet note) | Compliant |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | JTAG, AS, PS, FPP |
| Total Memory Bits | — | 8,475 Kbits |
| Embedded 18x18 Multipliers | — | 396 |
| User I/O Pins | — | 429 |
| Maximum Operating Frequency | — | 274 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Package Pins | — | 780 |
| Moisture Sensitivity Level | — | MSL 3 |