EP3CLS200F780I7N vs EP3CLS200F780I7 Comparación
Comparación detallada lado a lado de EP3CLS200F780I7N por Intel y EP3CLS200F780I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F780I7N | EP3CLS200F780I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $240,00 | $142,50 |
| Device Family | Cyclone III LS | Cyclone III LS |
| Series | EP3CLS200 | Cyclone III LS |
| Logic Elements | 198,464 | 198,464 |
| Logic Array Blocks (LABs) | 12,404 LAB | 12,040 LAB |
| Embedded Memory (bits) | 8,211,456 | — |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 413 | — |
| Process Technology | 65 nm CMOS (low-power) | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (industrial) | -40 C to +85 C (Industrial) |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| Encapsulado | 780-ball FBGA (FBGA-780) | 780-BGA (FBGA) |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount (SMD/SMT) |
| Estado RoHS | Compliant (lead-free per FBGA-780 datasheet note) | Compliant |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | JTAG, AS, PS, FPP |
| Total Memory Bits | — | 8,475 Kbits |
| Embedded 18x18 Multipliers | — | 396 |
| User I/O Pins | — | 429 |
| Maximum Operating Frequency | — | 274 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Package Pins | — | 780 |
| Moisture Sensitivity Level | — | MSL 3 |