EP3SE110F1152C2 vs EP3SE260F1152C2 Vergleich
Detaillierter Direktvergleich von EP3SE110F1152C2 von Intel und EP3SE260F1152C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE110F1152C2 | EP3SE260F1152C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.100,00 | $2.400,00 |
| Family | Stratix III E (Enhanced) | — |
| Logic Elements | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 10,200 |
| Adaptive Logic Modules (ALMs) | 53,750 | — |
| Embedded Memory (bits) | 8,936,448 | 16,672,768 |
| Maximum User I/Os | 744 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 0.9 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Betriebstemperatur | 0C to 85C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Gehäuse | 1152-ball FC-BGA | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | F1152 | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Device Type | FPGA | — |
| Configuration | SRAM-based, volatile (requires configuration device) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Speed Grade | — | C2 (commercial) |
| RoHS-Status | — | Compliant |
| Lead-Free | — | Yes |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |