EP3SE110F1152C2 vs EP3SE260F1152C2 Comparison
Detailed side-by-side comparison of EP3SE110F1152C2 by Intel and EP3SE260F1152C2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Last Time BuySpecification Comparison
| Parameter | EP3SE110F1152C2 | EP3SE260F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Obsolete |
| Family | Stratix III E (Enhanced) | — |
| Logic Elements | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 10,200 |
| Adaptive Logic Modules (ALMs) | 53,750 | — |
| Embedded Memory (bits) | 8,936,448 | 16,672,768 |
| Maximum User I/Os | 744 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 0.9 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Operating Temperature | 0C to 85C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Package | 1152-ball FC-BGA | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | F1152 | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Device Type | FPGA | — |
| Configuration | SRAM-based, volatile (requires configuration device) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Speed Grade | — | C2 (commercial) |
| RoHS Status | — | Compliant |
| Lead-Free | — | Yes |
| MSL Level | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |