EP3SE110F1152C2 vs EP3SE260F1152C2 Comparación
Comparación detallada lado a lado de EP3SE110F1152C2 por Intel y EP3SE260F1152C2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE110F1152C2 | EP3SE260F1152C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.100,00 | $2.400,00 |
| Family | Stratix III E (Enhanced) | — |
| Logic Elements | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 10,200 |
| Adaptive Logic Modules (ALMs) | 53,750 | — |
| Embedded Memory (bits) | 8,936,448 | 16,672,768 |
| Maximum User I/Os | 744 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 0.9 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Temperatura de funcionamiento | 0C to 85C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Encapsulado | 1152-ball FC-BGA | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | F1152 | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Device Type | FPGA | — |
| Configuration | SRAM-based, volatile (requires configuration device) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Speed Grade | — | C2 (commercial) |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |