EP3SE110F1152C4 vs EP3SE110F1152C2 Vergleich
Detaillierter Direktvergleich von EP3SE110F1152C4 von Intel und EP3SE110F1152C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Letzte BestellmöglichkeitIntel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE110F1152C4 | EP3SE110F1152C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.200,00 | $4.100,00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 107,500 | 107,500 |
| Embedded Memory | 8,936,448 bits | — |
| Maximum User I/Os | 744 | 744 |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 4,300 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 0.9 V |
| Maximum Performance | 450 MHz | — |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Operating Temperature Grade | Commercial (C4) | — |
| Configuration Memory | SRAM-based (volatile) | — |
| On-chip Termination | Dynamic, programmable | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| RoHS-Status | Compliant | — |
| Adaptive Logic Modules (ALMs) | — | 53,750 |
| Embedded Memory (bits) | — | 8,936,448 |
| Maximum Internal Frequency | — | 800 MHz |
| Betriebstemperatur | — | 0C to 85C (Commercial) |
| Gehäuse | — | 1152-ball FC-BGA |
| Package Code | — | F1152 |
| Montageart | — | Surface Mount (BGA) |
| Device Type | — | FPGA |
| Configuration | — | SRAM-based, volatile (requires configuration device) |