EP3SE110F1152C4 vs EP3SE110F1152C2 对比
详细并排对比 EP3SE110F1152C4 出自 Intel 和 EP3SE110F1152C2 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE110F1152C4 | EP3SE110F1152C2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,200.00 | $4,100.00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 107,500 | 107,500 |
| Embedded Memory | 8,936,448 bits | — |
| Maximum User I/Os | 744 | 744 |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 4,300 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 0.9 V |
| Maximum Performance | 450 MHz | — |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Operating Temperature Grade | Commercial (C4) | — |
| Configuration Memory | SRAM-based (volatile) | — |
| On-chip Termination | Dynamic, programmable | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| RoHS 状态 | Compliant | — |
| Adaptive Logic Modules (ALMs) | — | 53,750 |
| Embedded Memory (bits) | — | 8,936,448 |
| Maximum Internal Frequency | — | 800 MHz |
| 工作温度 | — | 0C to 85C (Commercial) |
| 封装 | — | 1152-ball FC-BGA |
| Package Code | — | F1152 |
| 安装类型 | — | Surface Mount (BGA) |
| Device Type | — | FPGA |
| Configuration | — | SRAM-based, volatile (requires configuration device) |