EP3SE110F780C3N vs EP3SE110F780C2 Vergleich
Detaillierter Direktvergleich von EP3SE110F780C3N von Intel und EP3SE110F780C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780C3N | EP3SE110F780C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.245,00 | $4.350,00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| User I/Os | 488 | — |
| Gehäuse | 780-ball FCBGA (Flip-Chip BGA) | 780-BBGA, FCBGA (FineLine) |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | 8,936,448 bits (8.93 Mbit) |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Series | — | EP3SE110 |
| Logic Elements (LE) | — | 107,500 |
| Maximum User I/O | — | 488 |
| Embedded Multipliers | — | 768 (18x18) |
| PLLs | — | 4 |
| Process Node | — | 65 nm |
| Core Voltage (VCCINT) | — | 1.1 V |
| Betriebstemperatur | — | 0C to +85C (Commercial) |
| Speed Grade | — | C2 |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |