EP3SE110F780C3N vs EP3SE110F780C2 Comparación
Comparación detallada lado a lado de EP3SE110F780C3N por Intel y EP3SE110F780C2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE110F780C3N | EP3SE110F780C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.245,00 | $4.350,00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| User I/Os | 488 | — |
| Encapsulado | 780-ball FCBGA (Flip-Chip BGA) | 780-BBGA, FCBGA (FineLine) |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | 8,936,448 bits (8.93 Mbit) |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Series | — | EP3SE110 |
| Logic Elements (LE) | — | 107,500 |
| Maximum User I/O | — | 488 |
| Embedded Multipliers | — | 768 (18x18) |
| PLLs | — | 4 |
| Process Node | — | 65 nm |
| Core Voltage (VCCINT) | — | 1.1 V |
| Temperatura de funcionamiento | — | 0C to +85C (Commercial) |
| Speed Grade | — | C2 |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |