EP3SE110F780C3N vs EP3SE110F780C4L Vergleich
Detaillierter Direktvergleich von EP3SE110F780C3N von Intel und EP3SE110F780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780C3N | EP3SE110F780C4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.245,00 | $1.550,00 |
| Family | Stratix III E | — |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| User I/Os | 488 | — |
| Gehäuse | 780-ball FCBGA (Flip-Chip BGA) | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | — |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020) |
| Series | — | Stratix III E |
| Number of Logic Elements (LE) | — | 107,500 |
| Number of Logic Array Blocks (LAB) | — | [DATA_NEEDED: number of LABs] |
| Total Memory Bits | — | 8,936,448 bits |
| Number of 18x18 Multipliers | — | 488 |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| User I/O Pins | — | 488 |
| Speed Grade | — | -4 (commercial) |
| Process Variant | — | L (low-leakage) |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Package Type | — | 780-Ball FCBGA |
| Ball Pitch | — | 1.0 mm |