EP3SE110F780C3N vs EP3SE110F780C4L 对比
详细并排对比 EP3SE110F780C3N 出自 Intel 和 EP3SE110F780C4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE110F780C3N | EP3SE110F780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,245.00 | $1,550.00 |
| Family | Stratix III E | — |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| User I/Os | 488 | — |
| 封装 | 780-ball FCBGA (Flip-Chip BGA) | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | — |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| RoHS 状态 | Compliant | Compliant |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020) |
| Series | — | Stratix III E |
| Number of Logic Elements (LE) | — | 107,500 |
| Number of Logic Array Blocks (LAB) | — | [DATA_NEEDED: number of LABs] |
| Total Memory Bits | — | 8,936,448 bits |
| Number of 18x18 Multipliers | — | 488 |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| User I/O Pins | — | 488 |
| Speed Grade | — | -4 (commercial) |
| Process Variant | — | L (low-leakage) |
| 工作温度 | — | 0C to +85C (commercial) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Package Type | — | 780-Ball FCBGA |
| Ball Pitch | — | 1.0 mm |