EP3SE110F780C3N vs EP3SE110F780C4L Comparaison
Comparaison détaillée côte à côte de EP3SE110F780C3N par Intel et EP3SE110F780C4L par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE110F780C3N | EP3SE110F780C4L |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 245,00 | $1 550,00 |
| Family | Stratix III E | — |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| User I/Os | 488 | — |
| Boîtier | 780-ball FCBGA (Flip-Chip BGA) | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | — |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Statut RoHS | Compliant | Compliant |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020) |
| Series | — | Stratix III E |
| Number of Logic Elements (LE) | — | 107,500 |
| Number of Logic Array Blocks (LAB) | — | [DATA_NEEDED: number of LABs] |
| Total Memory Bits | — | 8,936,448 bits |
| Number of 18x18 Multipliers | — | 488 |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| User I/O Pins | — | 488 |
| Speed Grade | — | -4 (commercial) |
| Process Variant | — | L (low-leakage) |
| Température de fonctionnement | — | 0C to +85C (commercial) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Package Type | — | 780-Ball FCBGA |
| Ball Pitch | — | 1.0 mm |