EP3SE110F780C3N vs EP3SE110F780I2N Vergleich
Detaillierter Direktvergleich von EP3SE110F780C3N von Intel und EP3SE110F780I2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780C3N | EP3SE110F780I2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.245,00 | $1.390,00 |
| Family | Stratix III E | Stratix III Enhanced |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| User I/Os | 488 | — |
| Gehäuse | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FBGA (29x29 mm) |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 40 nm CMOS |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | 12 (up to 8.5 Gbps) |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | — |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Logic Elements | — | 107,500 |
| Embedded Memory (M9K + M144K) | — | 8,244 Kbits |
| Embedded Multipliers (18x18) | — | 528 |
| User I/O Pins | — | 488 |
| PLLs | — | 8 |
| Hard Memory Controllers | — | 4 |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Speed Grade | — | 2 |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT nominal] |
| LVDS Support | — | Up to 1.4 Gbps |