EP3SE110F780C3N vs EP3SE110F780I2N Comparación
Comparación detallada lado a lado de EP3SE110F780C3N por Intel y EP3SE110F780I2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE110F780C3N | EP3SE110F780I2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.245,00 | $1.390,00 |
| Family | Stratix III E | Stratix III Enhanced |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| User I/Os | 488 | — |
| Encapsulado | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FBGA (29x29 mm) |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 40 nm CMOS |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | 12 (up to 8.5 Gbps) |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | — |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Logic Elements | — | 107,500 |
| Embedded Memory (M9K + M144K) | — | 8,244 Kbits |
| Embedded Multipliers (18x18) | — | 528 |
| User I/O Pins | — | 488 |
| PLLs | — | 8 |
| Hard Memory Controllers | — | 4 |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Speed Grade | — | 2 |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT nominal] |
| LVDS Support | — | Up to 1.4 Gbps |