EP3SE110F780C4L vs EP3SE110F780C4LN Vergleich
Detaillierter Direktvergleich von EP3SE110F780C4L von Intel und EP3SE110F780C4LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780C4L | EP3SE110F780C4LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.550,00 | $3.450,00 |
| Series | Stratix III E | — |
| Number of Logic Elements (LE) | 107,500 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | — |
| Total Memory Bits | 8,936,448 bits | — |
| Number of 18x18 Multipliers | 488 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| User I/O Pins | 488 | 488 |
| Speed Grade | -4 (commercial) | C4 |
| Process Variant | L (low-leakage) | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Package Type | 780-Ball FCBGA | — |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | Surface Mount (SMT) |
| Process Technology | 65 nm CMOS | 40 nm TSMC |
| RoHS-Status | Compliant | — |
| MSL-Level | 3 (per JEDEC J-STD-020) | 3 (per JEDEC J-STD-020) |
| Family | — | Stratix III E |
| Logic Elements (LE) | — | 107,500 |
| Logic Array Blocks (LABs) | — | 4,300 |
| Embedded Memory | — | 8,936,448 bits |
| Gehäuse | — | 780-BBGA, FCBGA (Fine-pitch) |
| Supply Voltage Core | — | 0.9 V (typical) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| DSP Blocks | — | Yes (18x18 multipliers) |
| Tray Packaging | — | Yes (per distributor listings) |