EP3SE110F780I3 vs EP3SE110F780C3N Vergleich
Detaillierter Direktvergleich von EP3SE110F780I3 von Intel und EP3SE110F780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780I3 | EP3SE110F780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.395,00 | $1.245,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107500 | — |
| Number of LABs/CLBs | 4300 | — |
| Number of Logic Elements/Cells | 107500 | — |
| Total RAM Bits | 8936448 | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 1.1 V core | — |
| Process Technology | 65 nm | 65 nm |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +100C (industrial) | — |
| Gehäuse / Bauform | 780-BBGA, FCBGA (FineLine BGA) | — |
| Supplier Device Package | 780-FBGA | — |
| RoHS-Status | unknown | Compliant |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | unknown | — |
| Grade | Industrial | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| Logic Array Blocks (LABs) | — | 4,300 |
| User I/Os | — | 488 |
| Gehäuse | — | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 500 MHz |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Embedded Memory | — | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |