EP3SE110F780I3 vs EP3SE110F780C3N Comparación
Comparación detallada lado a lado de EP3SE110F780I3 por Intel y EP3SE110F780C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE110F780I3 | EP3SE110F780C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $1.245,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107500 | — |
| Number of LABs/CLBs | 4300 | — |
| Number of Logic Elements/Cells | 107500 | — |
| Total RAM Bits | 8936448 | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 1.1 V core | — |
| Process Technology | 65 nm | 65 nm |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +100C (industrial) | — |
| Encapsulado / Carcasa | 780-BBGA, FCBGA (FineLine BGA) | — |
| Supplier Device Package | 780-FBGA | — |
| Estado RoHS | unknown | Compliant |
| Nivel de sensibilidad a la humedad (MSL) | unknown | — |
| Grade | Industrial | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| Logic Array Blocks (LABs) | — | 4,300 |
| User I/Os | — | 488 |
| Encapsulado | — | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 500 MHz |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Embedded Memory | — | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |