EP3SE110F780I4L vs EP3SE110F780C4L Vergleich

Detaillierter Direktvergleich von EP3SE110F780I4L von Intel und EP3SE110F780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE110F780I4L EP3SE110F780C4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.395,00 $1.550,00
Family Stratix III E —
Logic Elements 107,500 —
LABs (Logic Array Blocks) 4,300 —
User I/Os 488 —
Embedded Memory 8,936,448 bits (8.9 Mbit) —
Maximum Operating Frequency 375 MHz —
Process Technology 65 nm CMOS 65 nm CMOS
Core Voltage 0.9 V —
Gehäuse 780-pin FC-FBGA (Flip-Chip BGA) —
Package Body Size 29 mm × 29 mm —
Ball Pitch 1.0 mm 1.0 mm
Operating Temperature (Industrial) -40 °C to +100 °C —
Montageart Surface Mount (FC-FBGA) Surface Mount
RoHS-Status Compliant (per legacy Altera data) Compliant
Product Status Not Recommended for New Designs (NRND) —
Series — Stratix III E
Number of Logic Elements (LE) — 107,500
Number of Logic Array Blocks (LAB) — [DATA_NEEDED: number of LABs]
Total Memory Bits — 8,936,448 bits
Number of 18x18 Multipliers — 488
Number of PLLs — [DATA_NEEDED: PLL count]
User I/O Pins — 488
Speed Grade — -4 (commercial)
Process Variant — L (low-leakage)
Betriebstemperatur — 0C to +85C (commercial)
Supply Voltage (Core) — [DATA_NEEDED: core voltage]
Package Type — 780-Ball FCBGA
MSL-Level — 3 (per JEDEC J-STD-020)

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