EP3SE110F780I4L vs EP3SE110F780C4N Vergleich
Detaillierter Direktvergleich von EP3SE110F780I4L von Intel und EP3SE110F780C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780I4L | EP3SE110F780C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.395,00 | $1.395,00 |
| Family | Stratix III E | Stratix III |
| Logic Elements | 107,500 | — |
| LABs (Logic Array Blocks) | 4,300 | — |
| User I/Os | 488 | — |
| Embedded Memory | 8,936,448 bits (8.9 Mbit) | — |
| Maximum Operating Frequency | 375 MHz | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 0.9 V | — |
| Gehäuse | 780-pin FC-FBGA (Flip-Chip BGA) | — |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature (Industrial) | -40 °C to +100 °C | — |
| Montageart | Surface Mount (FC-FBGA) | Surface Mount |
| RoHS-Status | Compliant (per legacy Altera data) | Compliant |
| Product Status | Not Recommended for New Designs (NRND) | — |
| Series | — | Stratix III E |
| Logic Elements (LEs) | — | 107500 |
| Embedded Memory Bits | — | 8936448 |
| User I/O Count | — | 488 |
| Number of Terminals | — | 780 |
| Package Type | — | 780-BBGA, FCBGA |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Speed Grade | — | C4 |
| Betriebstemperatur | — | 0C to 85C (Commercial) |
| Process Node | — | 65 nm |
| Configuration Mode | — | PS / FPP / JTAG |