EP3SE260F1152C2 vs EP3SE260F1152C4 Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C2 von Intel und EP3SE260F1152C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C2 EP3SE260F1152C4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.400,00 $8.900,00
Manufacturer Intel (formerly Altera) —
Series Stratix® III E Stratix III E (Enhanced)
Logic Elements (LE) 255,000 255,000
Logic Array Blocks (LABs) 10,200 10,200
Embedded Memory (bits) 16,672,768 —
User I/Os 744 —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS (TSMC)
Gehäuse 1152-ball FC-FBGA (Flip Chip) 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Montageart Surface Mount Surface Mount (BGA)
Speed Grade C2 (commercial) C4 (slowest commercial grade)
Betriebstemperatur Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] Commercial (0C to +85C) - inferred from speed grade C4
RoHS-Status Compliant Compliant (per distributor listings)
Lead-Free Yes —
MSL-Level [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Core Voltage — 1.1 V
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)

Datenblätter & Ressourcen

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