EP3SE260F1152C2N vs EP3SE260F1152C4 Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C2N von Intel und EP3SE260F1152C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C2N EP3SE260F1152C4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $11.000,00 $8.900,00
Series Stratix III E Stratix III E (Enhanced)
Family FPGA - Field Programmable Gate Array Stratix III
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 —
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur [DATA_NEEDED: operating temperature grade] Commercial (0C to +85C) - inferred from speed grade C4
Gehäuse / Bauform 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm CMOS (TSMC)
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status Compliant Compliant (per distributor listings)
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements (LE) — 255,000
Logic Array Blocks (LABs) — 10,200
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Core Voltage — 1.1 V
Speed Grade — C4 (slowest commercial grade)
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Gehäuse — 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)

Datenblätter & Ressourcen

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