EP3SE260F1152C2N vs EP3SE260F1152I3 Vergleich
Detaillierter Direktvergleich von EP3SE260F1152C2N von Intel und EP3SE260F1152I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1152C2N | EP3SE260F1152I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11.000,00 | $16.500,00 |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Family | FPGA - Field Programmable Gate Array | — |
| Number of Logic Elements | 255000 | — |
| Number of LABs/CLBs | 10200 | 10,200 |
| Total Memory Bits | 16672768 | — |
| Number of I/O | 744 | — |
| Voltage - Supply | 1.1 V | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature grade] | -40C to +100C (Industrial) |
| Gehäuse / Bauform | 1152-BBGA, FCBGA | — |
| Process Technology | 65 nm | 65 nm |
| Maximum Frequency | 600 MHz | — |
| Supplier Device Package | 1152-FCBGA | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes (per EP3SE260F1152C2G comparison) | — |
| ECCN | [DATA_NEEDED: ECCN code] | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 255,000 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Core Voltage | — | 1.1 V |
| Maximum Fabric Frequency | — | 500 MHz |
| Gehäuse | — | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| Product Status | — | Obsolete (per Xecor comparator) |