EP3SE260F1152C2N vs EP3SE260F1152I3 对比
详细并排对比 EP3SE260F1152C2N 出自 Intel 和 EP3SE260F1152I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1152C2N | EP3SE260F1152I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $11,000.00 | $16,500.00 |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Family | FPGA - Field Programmable Gate Array | — |
| Number of Logic Elements | 255000 | — |
| Number of LABs/CLBs | 10200 | 10,200 |
| Total Memory Bits | 16672768 | — |
| Number of I/O | 744 | — |
| Voltage - Supply | 1.1 V | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: operating temperature grade] | -40C to +100C (Industrial) |
| 封装 / 外壳 | 1152-BBGA, FCBGA | — |
| Process Technology | 65 nm | 65 nm |
| Maximum Frequency | 600 MHz | — |
| Supplier Device Package | 1152-FCBGA | — |
| MSL 等级 | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes (per EP3SE260F1152C2G comparison) | — |
| ECCN | [DATA_NEEDED: ECCN code] | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 255,000 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Core Voltage | — | 1.1 V |
| Maximum Fabric Frequency | — | 500 MHz |
| 封装 | — | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| Product Status | — | Obsolete (per Xecor comparator) |