EP3SE260F1152C2N vs EP3SE260F1152I3 Comparaison
Comparaison détaillée côte à côte de EP3SE260F1152C2N par Intel et EP3SE260F1152I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE260F1152C2N | EP3SE260F1152I3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $11 000,00 | $16 500,00 |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Family | FPGA - Field Programmable Gate Array | — |
| Number of Logic Elements | 255000 | — |
| Number of LABs/CLBs | 10200 | 10,200 |
| Total Memory Bits | 16672768 | — |
| Number of I/O | 744 | — |
| Voltage - Supply | 1.1 V | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | [DATA_NEEDED: operating temperature grade] | -40C to +100C (Industrial) |
| Boîtier / Format | 1152-BBGA, FCBGA | — |
| Process Technology | 65 nm | 65 nm |
| Maximum Frequency | 600 MHz | — |
| Supplier Device Package | 1152-FCBGA | — |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes (per EP3SE260F1152C2G comparison) | — |
| ECCN | [DATA_NEEDED: ECCN code] | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 255,000 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Core Voltage | — | 1.1 V |
| Maximum Fabric Frequency | — | 500 MHz |
| Boîtier | — | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| Product Status | — | Obsolete (per Xecor comparator) |