EP3SE260F1152C3NES vs EP3SE260F1152C2G Vergleich
Detaillierter Direktvergleich von EP3SE260F1152C3NES von Altera und EP3SE260F1152C2G von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Altera
EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera
EP3SE260F1152C3NES ⚠ Letzte BestellmöglichkeitAltera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoleteSpezifikationsvergleich
| Parameter | EP3SE260F1152C3NES | EP3SE260F1152C2G |
|---|---|---|
| Marke | Altera | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.120,00 | $2.050,00 |
| Manufacturer | Altera (now Intel FPGA) | — |
| Series | Stratix III E | EP3SE260 |
| Family | Stratix III Enhanced | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Number of I/Os | 744 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage | 1.1 V | — |
| Number of 18x18 Multipliers | 768 | — |
| Number of PLLs | 12 | — |
| Package Type | 1152-ball FBGA (FineLine BGA) | — |
| Pin/Package Designator | F1152 | — |
| Speed Grade | -3 (faster) | C2 (commercial) |
| Hard Memory Controllers | 4 | — |
| Hard PCIe Blocks | 4 | — |
| External Memory Interface | DDR3, DDR2, DDR, QDRII+, RLDRAM2 | — |
| Operating Temperature Grade | Commercial | Commercial (C) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant (G suffix) |
| Lead-Free | Yes | — |
| Logic Elements / Cells | — | 255000 |
| Total RAM Bits | — | 16672768 |
| Number of LABs / CLBs | — | 10200 |
| Number of I/O | — | 744 |
| Number of Terminals | — | 1152 |
| Gehäuse | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Package Code | — | BGA (Ball Grid Array) |
| Package Shape | — | Square |
| Technology / Process Node | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Lead-Free (RoHS) | — | Yes (G suffix) |
| Supply Packaging | — | Tray |