EP3SE260F1152C3NES vs EP3SE260F1152C2G Comparación
Comparación detallada lado a lado de EP3SE260F1152C3NES por Altera y EP3SE260F1152C2G por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera
EP3SE260F1152C3NES ⚠ Última compraAltera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoleteComparación de especificaciones
| Parámetro | EP3SE260F1152C3NES | EP3SE260F1152C2G |
|---|---|---|
| Marca | Altera | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.120,00 | $2.050,00 |
| Manufacturer | Altera (now Intel FPGA) | — |
| Series | Stratix III E | EP3SE260 |
| Family | Stratix III Enhanced | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Number of I/Os | 744 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage | 1.1 V | — |
| Number of 18x18 Multipliers | 768 | — |
| Number of PLLs | 12 | — |
| Package Type | 1152-ball FBGA (FineLine BGA) | — |
| Pin/Package Designator | F1152 | — |
| Speed Grade | -3 (faster) | C2 (commercial) |
| Hard Memory Controllers | 4 | — |
| Hard PCIe Blocks | 4 | — |
| External Memory Interface | DDR3, DDR2, DDR, QDRII+, RLDRAM2 | — |
| Operating Temperature Grade | Commercial | Commercial (C) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant (G suffix) |
| Lead-Free | Yes | — |
| Logic Elements / Cells | — | 255000 |
| Total RAM Bits | — | 16672768 |
| Number of LABs / CLBs | — | 10200 |
| Number of I/O | — | 744 |
| Number of Terminals | — | 1152 |
| Encapsulado | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Package Code | — | BGA (Ball Grid Array) |
| Package Shape | — | Square |
| Technology / Process Node | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Lead-Free (RoHS) | — | Yes (G suffix) |
| Supply Packaging | — | Tray |