EP3SE260F1152C3NES vs EP3SE260F1152C2G Comparaison
Comparaison détaillée côte à côte de EP3SE260F1152C3NES par Altera et EP3SE260F1152C2G par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Altera
EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera
EP3SE260F1152C3NES ⚠ Dernier achatAltera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoleteComparaison des spécifications
| Paramètre | EP3SE260F1152C3NES | EP3SE260F1152C2G |
|---|---|---|
| Marque | Altera | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2 120,00 | $2 050,00 |
| Manufacturer | Altera (now Intel FPGA) | — |
| Series | Stratix III E | EP3SE260 |
| Family | Stratix III Enhanced | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Number of I/Os | 744 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage | 1.1 V | — |
| Number of 18x18 Multipliers | 768 | — |
| Number of PLLs | 12 | — |
| Package Type | 1152-ball FBGA (FineLine BGA) | — |
| Pin/Package Designator | F1152 | — |
| Speed Grade | -3 (faster) | C2 (commercial) |
| Hard Memory Controllers | 4 | — |
| Hard PCIe Blocks | 4 | — |
| External Memory Interface | DDR3, DDR2, DDR, QDRII+, RLDRAM2 | — |
| Operating Temperature Grade | Commercial | Commercial (C) |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant | Compliant (G suffix) |
| Lead-Free | Yes | — |
| Logic Elements / Cells | — | 255000 |
| Total RAM Bits | — | 16672768 |
| Number of LABs / CLBs | — | 10200 |
| Number of I/O | — | 744 |
| Number of Terminals | — | 1152 |
| Boîtier | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Package Code | — | BGA (Ball Grid Array) |
| Package Shape | — | Square |
| Technology / Process Node | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Lead-Free (RoHS) | — | Yes (G suffix) |
| Supply Packaging | — | Tray |