EP3SE260F1152I3 vs EP3SE260F1152C4N Vergleich
Detaillierter Direktvergleich von EP3SE260F1152I3 von Intel und EP3SE260F1152C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1152I3 | EP3SE260F1152C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16.500,00 | $1.620,00 |
| Series | Stratix III E (EP3SE260) | Stratix III E |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to +85C (commercial, 'C' suffix) |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Fabric Frequency | 500 MHz | — |
| Gehäuse | 1152-BBGA, FC-FBGA (Flip-Chip) | 1152-ball FC-FBGA (flip-chip) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Speed Grade | I3 (Industrial, speed bin 3) | -4 (commercial temperature) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Product Status | Obsolete (per Xecor comparator) | Obsolete (per Xecor cross-reference data) |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Speichertyp | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |