EP3SE260F1152I3G vs EP3SE260F1152C3N Vergleich

Detaillierter Direktvergleich von EP3SE260F1152I3G von Intel und EP3SE260F1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152I3G EP3SE260F1152C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.240,00 $7.500,00
Series Stratix III E Stratix III E
Family Stratix III —
Logic Elements (LE) 255,000 —
Embedded Memory Bits 16,672,640 bits 16,672,768 bits
Embedded Memory Bits (alternate) 20,880 Kb (16,672,640 / 1024) —
User I/O Count 744 744
Gehäuse 1152-BBGA, FCBGA (FineLine BGA) 1152-BBGA, FCBGA
Betriebstemperaturbereich -40C to +100C (Industrial) —
Speed Grade I3 (Industrial, balanced) —
Process Technology 40 nm TSMC low-power 65 nm
Supply Voltage Core 0.9 V (typical, see handbook) —
Configuration Bitstream Encryption AES-256 (Stratix III feature) —
I/O Standards Supported LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status [DATA_NEEDED: RoHS compliance not stated in scraped data] Compliant
Feuchtigkeitsempfindlichkeitsgrad (MSL) [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Lead-Free Reflow [DATA_NEEDED: peak reflow temperature] —
Design Toolchain Quartus II / Quartus Prime —
Country of Origin / Distribution Multiple authorized distributors (DigiKey, Mouser) —
Logic Elements / Cells — 255,000
Logic Array Blocks (LABs) — 10,200
Core Voltage — 1.1 V
Betriebstemperatur — 0 C to +85 C (Commercial)
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

Datenblätter & Ressourcen

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