EP3SE260F1152I3G vs EP3SE260F1152C3N 对比

详细并排对比 EP3SE260F1152I3G 出自 Intel 和 EP3SE260F1152C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE260F1152I3G EP3SE260F1152C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $1,240.00 $7,500.00
Series Stratix III E Stratix III E
Family Stratix III —
Logic Elements (LE) 255,000 —
Embedded Memory Bits 16,672,640 bits 16,672,768 bits
Embedded Memory Bits (alternate) 20,880 Kb (16,672,640 / 1024) —
User I/O Count 744 744
封装 1152-BBGA, FCBGA (FineLine BGA) 1152-BBGA, FCBGA
工作温度范围 -40C to +100C (Industrial) —
Speed Grade I3 (Industrial, balanced) —
Process Technology 40 nm TSMC low-power 65 nm
Supply Voltage Core 0.9 V (typical, see handbook) —
Configuration Bitstream Encryption AES-256 (Stratix III feature) —
I/O Standards Supported LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X —
安装类型 Surface Mount (BGA) Surface Mount
RoHS 状态 [DATA_NEEDED: RoHS compliance not stated in scraped data] Compliant
湿敏等级(MSL) [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Lead-Free Reflow [DATA_NEEDED: peak reflow temperature] —
Design Toolchain Quartus II / Quartus Prime —
Country of Origin / Distribution Multiple authorized distributors (DigiKey, Mouser) —
Logic Elements / Cells — 255,000
Logic Array Blocks (LABs) — 10,200
Core Voltage — 1.1 V
工作温度 — 0 C to +85 C (Commercial)
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

数据手册与资源

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