EP3SE260F1152I3G vs EP3SE260F1152C3N Comparaison
Comparaison détaillée côte à côte de EP3SE260F1152I3G par Intel et EP3SE260F1152C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ ActifComparaison des spécifications
| Paramètre | EP3SE260F1152I3G | EP3SE260F1152C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 240,00 | $7 500,00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,640 bits | 16,672,768 bits |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | — |
| User I/O Count | 744 | 744 |
| Boîtier | 1152-BBGA, FCBGA (FineLine BGA) | 1152-BBGA, FCBGA |
| Plage de température de fonctionnement | -40C to +100C (Industrial) | — |
| Speed Grade | I3 (Industrial, balanced) | — |
| Process Technology | 40 nm TSMC low-power | 65 nm |
| Supply Voltage Core | 0.9 V (typical, see handbook) | — |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | — |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS compliance not stated in scraped data] | Compliant |
| Niveau de sensibilité à l'humidité (MSL) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | — |
| Logic Elements / Cells | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Core Voltage | — | 1.1 V |
| Température de fonctionnement | — | 0 C to +85 C (Commercial) |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |