EP3SE260F1517C2G vs EP3SE260F1517I3 Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C2G von Intel und EP3SE260F1517I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517C2G | EP3SE260F1517I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.050,00 | $10.500,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 255,000 |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | — |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | — |
| Gehäuse | 1517-ball FCBGA, 40x40 mm | 1517-BBGA, FCBGA |
| Speed Grade | C2 (commercial, ~6 ns) | — |
| Betriebstemperatur | 0C to 85C (commercial, "C" suffix) | — |
| Process Node | 40 nm TSMC | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Embedded Memory (bits) | — | 16,672,768 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/Os | — | 976 |
| Montageart | — | Surface Mount |
| Operating Temperature Grade | — | Industrial |
| Junction Temperature Range | — | -40C to +125C |
| Core Voltage | — | 1.0 V typical |
| Process Technology | — | 65 nm CMOS |
| Maximum Core Frequency | — | 717 MHz |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| Configuration | — | SRAM-based, volatile (requires external configuration device) |