EP3SE260F1517C4LN vs EP3SE260F1517C2G Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C4LN von Intel und EP3SE260F1517C2G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260F1517C4LN | EP3SE260F1517C2G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.450,00 | $2.050,00 |
| Series | Stratix III E | — |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | 254,400 |
| Number of LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 (16.67 Mbit) | 16,727,680 (16.67 Mbit) |
| Number of I/O | 976 | — |
| Number of Gates | [DATA_NEEDED: gate count not published in web data] | — |
| Voltage - Supply | 0.9 V to 1.1 V core | — |
| Operating Frequency | 375 MHz to 450 MHz (per family) | — |
| Process Technology | 65 nm | — |
| Gehäuse / Bauform | 1517-BBGA, FCBGA (FC-FBGA) | — |
| Montageart | Surface Mount (flip-chip) | — |
| Betriebstemperatur | 0C to +85C (commercial grade per 'C' suffix) | 0C to 85C (commercial, "C" suffix) |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Speed Grade | C4 | C2 (commercial, ~6 ns) |
| Lead-Free / Halogen-Free | Yes (LN suffix) | Yes / Yes |
| RoHS-Status | Compliant | Compliant |
| Adaptive Logic Modules (ALMs) | — | 81,760 |
| Embedded Memory (M9K Blocks) | — | 864 |
| Embedded Multipliers (18x18) | — | 768 |
| User I/O Pins | — | 976 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 3.75 Gbps (C2 grade) |
| PLLs (Fractional + Clock Multiplier) | — | 8 fractional + 4 CMU |
| Global Clock Networks | — | 20 |
| Gehäuse | — | 1517-ball FCBGA, 40x40 mm |
| Process Node | — | 40 nm TSMC |