EP3SE260F1517I3 vs EP3SE260F1517C3 Vergleich
Detaillierter Direktvergleich von EP3SE260F1517I3 von Intel und EP3SE260F1517C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517I3 | EP3SE260F1517C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.500,00 | $10.800,00 |
| Family | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Maximum User I/Os | 976 | — |
| Gehäuse | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FineLine BGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial | Commercial (C suffix) |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | 0.9 V |
| Process Technology | 65 nm CMOS | — |
| Maximum Core Frequency | 717 MHz | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| RoHS-Status | Compliant | Compliant |
| Configuration | SRAM-based, volatile (requires external configuration device) | SRAM-based, requires external configuration device |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm (TSMC) |
| Package Pitch | — | 1.0 mm |
| Speed Grade | — | 3 |