EP3SE260F1517I3 vs EP3SE260F1517C3 Comparación
Comparación detallada lado a lado de EP3SE260F1517I3 por Intel y EP3SE260F1517C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1517I3 | EP3SE260F1517C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.500,00 | $10.800,00 |
| Family | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Maximum User I/Os | 976 | — |
| Encapsulado | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial | Commercial (C suffix) |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | 0.9 V |
| Process Technology | 65 nm CMOS | — |
| Maximum Core Frequency | 717 MHz | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Estado RoHS | Compliant | Compliant |
| Configuration | SRAM-based, volatile (requires external configuration device) | SRAM-based, requires external configuration device |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm (TSMC) |
| Package Pitch | — | 1.0 mm |
| Speed Grade | — | 3 |