EP3SE260F1517I3G vs EP3SE260F1517I3 Vergleich
Detaillierter Direktvergleich von EP3SE260F1517I3G von Intel und EP3SE260F1517I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517I3G | EP3SE260F1517I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.520,00 | $10.500,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Core Voltage | 1.1 V | 1.0 V typical |
| User I/O Count | 976 | — |
| Gehäuse | 1517-ball FC-FBGA (Flip-Chip BGA) | 1517-BBGA, FCBGA |
| Montageart | Surface Mount | Surface Mount |
| Process Node | 65 nm | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLL Count | 12 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial |
| Lead-Free / RoHS | Yes (RoHS compliant per DigiKey listing) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Embedded Memory (bits) | — | 16,672,768 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/Os | — | 976 |
| Junction Temperature Range | — | -40C to +125C |
| Process Technology | — | 65 nm CMOS |
| Maximum Core Frequency | — | 717 MHz |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| RoHS-Status | — | Compliant |
| Configuration | — | SRAM-based, volatile (requires external configuration device) |