EP3SE260F1517I3G vs EP3SE260F1517I3N Vergleich
Detaillierter Direktvergleich von EP3SE260F1517I3G von Intel und EP3SE260F1517I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517I3G | EP3SE260F1517I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.520,00 | $2.275,00 |
| Family | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 | 16,672,768 bits |
| Maximum Operating Frequency | 500 MHz | — |
| Core Voltage | 1.1 V | 1.1 V |
| User I/O Count | 976 | 976 |
| Gehäuse | 1517-ball FC-FBGA (Flip-Chip BGA) | 1517-ball FC-FBGA |
| Montageart | Surface Mount | Surface Mount |
| Process Node | 65 nm | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLL Count | 12 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Lead-Free / RoHS | Yes (RoHS compliant per DigiKey listing) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Logic Array Blocks (LABs) | — | 10,200 |
| Process Technology | — | 65 nm |
| Speed Grade | — | -3 (fastest) |
| Temperature Grade | — | Industrial (I): -40 °C to +100 °C |
| Betriebs-Sperrschichttemperatur | — | -40 °C to +100 °C |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |
| RoHS-Status | — | Compliant |
| Lead-Free | — | Yes |
| Internal Logic Performance | — | Up to 500 MHz |
| Memory Subsystems | — | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |
| DSP Blocks | — | Yes (dedicated multiply-accumulate) |