EP3SE260F1517I3N vs EP3SE260F1517I4LN Vergleich
Detaillierter Direktvergleich von EP3SE260F1517I3N von Intel und EP3SE260F1517I4LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260F1517I3N | EP3SE260F1517I4LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.275,00 | $2.895,00 |
| Family | Stratix® III E | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | 16,672,768 bits (~2,044 KBytes) |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/O Count | 976 | 976 |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 40 nm CMOS |
| Gehäuse | 1517-ball FC-FBGA | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Montageart | Surface Mount | — |
| Speed Grade | -3 (fastest) | I4 (industrial, 4th tier) |
| Temperature Grade | Industrial (I): -40 °C to +100 °C | — |
| Betriebs-Sperrschichttemperatur | -40 °C to +100 °C | — |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Internal Logic Performance | Up to 500 MHz | — |
| Memory Subsystems | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers | — |
| DSP Blocks | Yes (dedicated multiply-accumulate) | — |
| Power Option | — | L (low-power) |
| Betriebstemperatur | — | -40C to +100C (case, industrial) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Transceivers | — | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| DSP Blocks (18x18 multipliers) | — | Up to 384 (family-level, device-specific count not in provided data) |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |