EP3SE260F1517I3N vs EP3SE260F1517I4LN Comparaison
Comparaison détaillée côte à côte de EP3SE260F1517I3N par Intel et EP3SE260F1517I4LN par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP3SE260F1517I3N | EP3SE260F1517I4LN |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2 275,00 | $2 895,00 |
| Family | Stratix® III E | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | 16,672,768 bits (~2,044 KBytes) |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/O Count | 976 | 976 |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 40 nm CMOS |
| Boîtier | 1517-ball FC-FBGA | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Type de montage | Surface Mount | — |
| Speed Grade | -3 (fastest) | I4 (industrial, 4th tier) |
| Temperature Grade | Industrial (I): -40 °C to +100 °C | — |
| Température de jonction en fonctionnement | -40 °C to +100 °C | — |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Statut RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Internal Logic Performance | Up to 500 MHz | — |
| Memory Subsystems | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers | — |
| DSP Blocks | Yes (dedicated multiply-accumulate) | — |
| Power Option | — | L (low-power) |
| Température de fonctionnement | — | -40C to +100C (case, industrial) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Transceivers | — | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| DSP Blocks (18x18 multipliers) | — | Up to 384 (family-level, device-specific count not in provided data) |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |