EP3SE260F1517I4L vs EP3SE260F1517I3N Vergleich
Detaillierter Direktvergleich von EP3SE260F1517I4L von Intel und EP3SE260F1517I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517I4L | EP3SE260F1517I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.800,00 | $2.275,00 |
| Family | Stratix III Enhanced (E) | Stratix® III E |
| Series | Stratix III | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | — |
| Maximum User I/O | 976 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Temperature Grade | Industrial | Industrial (I): -40 °C to +100 °C |
| Speed Grade | I4 | -3 (fastest) |
| Lead-Free / RoHS | Yes (L suffix) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Process Technology | 65 nm CMOS | 65 nm |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | JTAG / Passive Serial / Active Serial |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| Core Voltage | — | 1.1 V |
| Gehäuse | — | 1517-ball FC-FBGA |
| Betriebs-Sperrschichttemperatur | — | -40 °C to +100 °C |
| Lead-Free | — | Yes |
| Internal Logic Performance | — | Up to 500 MHz |
| Memory Subsystems | — | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |
| DSP Blocks | — | Yes (dedicated multiply-accumulate) |