EP3SE260F1517I4N vs EP3SL200F1517I4LN Vergleich
Detaillierter Direktvergleich von EP3SE260F1517I4N von Intel und EP3SL200F1517I4LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP3SE260F1517I4N | EP3SL200F1517I4LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.500,00 | $6.300,00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory Bits | 16,672,768 bits | 10,901,504 |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | 976 |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power |
| Gehäuse | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Betriebstemperatur | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Operating Temperature Grade | Industrial (I4) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| MSL-Level | [DATA_NEEDED: MSL classification] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Family | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 8,000 |
| RoHS-Status | — | Compliant |
| Lead-Free | — | Yes |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max transceiver rate] |
| DSP Blocks (18x18 multipliers) | — | 384 |
| DSP Performance | — | 288 GMACS |
| Configuration Method | — | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 40 mm x 40 mm |