EP3SE260F1517I4N vs EP3SL200F1517I4LN 对比
详细并排对比 EP3SE260F1517I4N 出自 Intel 和 EP3SL200F1517I4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1517I4N | EP3SL200F1517I4LN |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10,500.00 | $6,300.00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory Bits | 16,672,768 bits | 10,901,504 |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | 976 |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power |
| 封装 | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| 工作温度 | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Operating Temperature Grade | Industrial (I4) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| MSL 等级 | [DATA_NEEDED: MSL classification] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Family | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 8,000 |
| RoHS 状态 | — | Compliant |
| Lead-Free | — | Yes |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max transceiver rate] |
| DSP Blocks (18x18 multipliers) | — | 384 |
| DSP Performance | — | 288 GMACS |
| Configuration Method | — | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 40 mm x 40 mm |