EP3SE260F1517I4N vs EP3SL200F1517I4LN Comparación
Comparación detallada lado a lado de EP3SE260F1517I4N por Intel y EP3SL200F1517I4LN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Última compra
Comparación de especificaciones
| Parámetro | EP3SE260F1517I4N | EP3SL200F1517I4LN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.500,00 | $6.300,00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory Bits | 16,672,768 bits | 10,901,504 |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | 976 |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power |
| Encapsulado | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Operating Temperature Grade | Industrial (I4) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| Nivel MSL | [DATA_NEEDED: MSL classification] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Family | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 8,000 |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max transceiver rate] |
| DSP Blocks (18x18 multipliers) | — | 384 |
| DSP Performance | — | 288 GMACS |
| Configuration Method | — | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 40 mm x 40 mm |