EP3SE260H780C3N vs EP3SE260H780C4L Vergleich

Detaillierter Direktvergleich von EP3SE260H780C3N von Intel und EP3SE260H780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260H780C3N EP3SE260H780C4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.325,00 $1.190,00
Series Stratix® III E —
Logic Elements (LE) 255,000 —
Embedded Memory (bits) 16,672,768 —
Number of LABs/CLBs 10,200 —
User I/Os 488 —
Number of Pins / Balls 780 —
Gehäuse 780-BBGA, FCBGA (H780) 780-ball FCBGA (HBGA 33x33 mm)
Montageart Surface Mount Surface Mount (flip-chip BGA)
Betriebstemperatur 0 °C to +85 °C (C grade, commercial) —
Process Technology 40 nm CMOS —
Maximum Core Frequency [DATA_NEEDED: maximum core frequency MHz] —
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal V] —
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] Up to 24 multi-gigabit transceivers
DSP Blocks [DATA_NEEDED: number of DSP blocks and precision] —
RoHS-Status Compliant (lead-free 'N' suffix) Compliant (lead-free per datasheet)
Feuchtigkeitsempfindlichkeitsgrad (MSL) [DATA_NEEDED: MSL level per JEDEC J-STD-020] —
Configuration Method SRAM-based, configured via JTAG / passive / active serial / fast passive parallel —
Design Toolchain Altera Quartus II (legacy); Intel Quartus Prime —
Family — Stratix III E
Logic Elements — 255,000
LABs/CLBs — 10,200
Total RAM Bits — 16,672,768 (16.7 Mbit)
User I/O Count — 488
Speed Grade — C4 (middle/slow tier)
Core Voltage — 0.9 V (nominal)
Betriebs-Sperrschichttemperatur — 0C to +85C (commercial)
MSL-Level — [DATA_NEEDED: MSL level]
Memory Interface — DDR3, DDR2, QDRII+, RLDRAM II controllers
Configuration Mode — PS, FPP, JTAG with EPCS/EPCQ

Datenblätter & Ressourcen

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