EP3SE260H780I3N vs EP3SE260H780I4L Vergleich
Detaillierter Direktvergleich von EP3SE260H780I3N von Intel und EP3SE260H780I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260H780I3N - Stratix III E FPGA 255K LE 780-FCBGA | Intel
EP3SE260H780I3N ⚠ Letzte BestellmöglichkeitIntel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260H780I3N | EP3SE260H780I4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.295,00 | $1.395,00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 488 | — |
| Operating Frequency (max) | 500 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Supply Voltage (VCCINT) | 1.1 V | — |
| Anzahl der Pins | 780 | — |
| Gehäuse | 780-FBGA (HBGA, FCBGA) | — |
| Package Code | BGA780 | — |
| Montageart | Surface Mount (FCBGA) | Surface Mount (flip-chip) |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 3 (mid) | — |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Lead-Free / Halogen-Free | Lead-Free (per datasheet family) | — |
| Programmable Logic Type | SRAM-based FPGA | — |
| Logic Elements | — | 255,000 |
| Total Memory Bits | — | 16,672,640 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| Betriebstemperatur | — | Industrial, -40C to +85C |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |