EP3SE260H780I3N vs EP3SE260H780I4L Comparaison
Comparaison détaillée côte à côte de EP3SE260H780I3N par Intel et EP3SE260H780I4L par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE260H780I3N - Stratix III E FPGA 255K LE 780-FCBGA | Intel
EP3SE260H780I3N ⚠ Dernier achatIntel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP3SE260H780I3N | EP3SE260H780I4L |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3 295,00 | $1 395,00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 488 | — |
| Operating Frequency (max) | 500 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Supply Voltage (VCCINT) | 1.1 V | — |
| Nombre de broches | 780 | — |
| Boîtier | 780-FBGA (HBGA, FCBGA) | — |
| Package Code | BGA780 | — |
| Type de montage | Surface Mount (FCBGA) | Surface Mount (flip-chip) |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 3 (mid) | — |
| Statut RoHS | Compliant | Compliant (lead-free) |
| Lead-Free / Halogen-Free | Lead-Free (per datasheet family) | — |
| Programmable Logic Type | SRAM-based FPGA | — |
| Logic Elements | — | 255,000 |
| Total Memory Bits | — | 16,672,640 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| Température de fonctionnement | — | Industrial, -40C to +85C |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |