EP3SE260H780I3N vs EP3SE260H780I4L Comparación
Comparación detallada lado a lado de EP3SE260H780I3N por Intel y EP3SE260H780I4L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260H780I3N - Stratix III E FPGA 255K LE 780-FCBGA | Intel
EP3SE260H780I3N ⚠ Última compraIntel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE260H780I3N | EP3SE260H780I4L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.295,00 | $1.395,00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 488 | — |
| Operating Frequency (max) | 500 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Supply Voltage (VCCINT) | 1.1 V | — |
| Número de pines | 780 | — |
| Encapsulado | 780-FBGA (HBGA, FCBGA) | — |
| Package Code | BGA780 | — |
| Tipo de montaje | Surface Mount (FCBGA) | Surface Mount (flip-chip) |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 3 (mid) | — |
| Estado RoHS | Compliant | Compliant (lead-free) |
| Lead-Free / Halogen-Free | Lead-Free (per datasheet family) | — |
| Programmable Logic Type | SRAM-based FPGA | — |
| Logic Elements | — | 255,000 |
| Total Memory Bits | — | 16,672,640 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| Temperatura de funcionamiento | — | Industrial, -40C to +85C |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |