EP3SE260H780I4 vs EP3SE260H780I4N Vergleich

Detaillierter Direktvergleich von EP3SE260H780I4 von Intel und EP3SE260H780I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP3SE260H780I4N EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP3SE260H780I4 EP3SE260H780I4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.390,00 $2.150,00
Family Stratix III Enhanced (Stratix III E) Stratix III Enhanced (Stratix III E)
Logic Elements 255,000 255,000
Logic Cells 255,000 —
Logic Array Blocks (LABs) 10,200 10,200
Adaptive Logic Modules (ALMs) approximately 203,200 —
Maximum User I/Os 488 —
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V 1.1 V
Embedded RAM (total) approximately 14.4 Mbit (M9K/M144K blocks) —
DSP Blocks approximately 768 (18x18 multipliers) —
Maximum Operating Frequency up to 450 MHz core / 717 MHz per Partstack record 450 MHz
Gehäuse 780-ball FC-HFBGA (HBGA) 780-pin FC-HFBGA (FCBGA)
Betriebstemperatur -40C to +100C (industrial, 'I' grade) -40C to +100C (Industrial)
Speed Grade 4 —
Montageart Surface Mount (BGA) —
Configuration Schemes JTAG, Passive Serial, Fast Passive Parallel, Active Serial —
RoHS-Status [DATA_NEEDED: RoHS compliance status] Compliant
Embedded Memory Bits — 16,672,768 bits
User I/Os — 488
Package Dimensions — 33 mm x 33 mm
Ball Pitch — [DATA_NEEDED: BGA ball pitch in mm]
Configuration Modes — AS, PS, JTAG, FPP
Boundary Scan — IEEE Std. 1149.1 (JTAG)
Lead-Free — Yes
Moisture Sensitivity Level — [DATA_NEEDED: MSL rating]

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